世纪末的魔术师 世纪末的魔术师 ,报告老板番外篇 报告老板番外篇 ,最后的深爱 百度影音 最后的深爱 百度影音

发布日期:2021年04月18日
世纪末的魔术师 世纪末的魔术师 ,报告老板番外篇 报告老板番外篇 ,最后的深爱 百度影音 最后的深爱 百度影音

Products

Semiconductor Packaging
BGA Sphere
BGA Sphere
Description
BGA Solder Sphere is made from pure metals, to produce exact alloy compositions. We developed and produced under a strict research and quality control policy.

Our Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip applications are made by the UMT ( Ultra Micron Technology) to ensure spheres with accurate diameters, bright, shiny surface finishes; and high sphericity. We have own developed technology which reduces raw material cost, accordingly competitive price make users benefited. With our newest in-house production machine, we can comply with customer’s request of various sizes. BGA Sphere is available for customers' specifications.


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Features
世纪末的魔术师 世纪末的魔术师 ,报告老板番外篇 报告老板番外篇 ,最后的深爱 百度影音 最后的深爱 百度影音
Diameter Tolerance
0.76mm~0.50mm ±20um
0.45mm~0.10mm ±10um
* Please contact us for other diameter and any requirement.
History
    3Inquiry